I-Etidronic Acid/ HEDP/CAS：2809-21-4
Inkcazo emfutshane:
Igama lemveliso: i-Etidronic Acid
I-CAS: 2809-21-4
I-MF: C2H8O7P2
I-MW: 206.03
ULWAKHIWO:
Ubuninzi: 1.45 (60% aq.)
Incopho yokutsha: 198~199℃
Imveliso ecocekileyo yikristale emhlophe. Imveliso yemizi-mveliso ayinambala ukuya kolulwelo olutyheli olukhanyayo. Inyibilika lula emanzini kwaye inyibilika kwi-methanol kunye ne-ethanol. I-Hydroxyethylidene diphosphonic acid yinto esetyenziswa njengekhemikhali kwaye idla ngokusetyenziswa kunyango lwamanzi kwimizi-mveliso, kwiimveliso zokucoca izindlu kunye neemveliso zokhathalelo lomntu.
iinkcukacha
| Into | Iinkcukacha |
| Inkangeleko | Ikristale emhlophe |
| Umxholo osebenzayo (njenge-asidi)% | ≥98.0% |
| Umxholo osebenzayo (njenge-HEDP.H20)% | ≥90.0% |
| I-PH(1%) | ≤2 |
| I-Phosphoric acid (njenge-PO43-)% | ≤0.5 |
| I-Chloride (njenge-CI-)ppm | ≤100 |
| I-Fe ion ppm | ≤5 |
| I-phosphorus acid (njenge-PO33-)% | ≤0.8 |
Ukusetyenziswa
Le mveliso yeyona nto iphambili yokwenza i-electroplating engena-cyanide. Xa yenziwe ibe sisisombululo se-electroplating se-copper esingenayo i-cyanide, inamandla amahle okubopha xa i-electroplating ngokuthe ngqo kumaleko we-copper kwi-sodium iron. Ingubo igudile kwaye inokukhanya okuhle. Ngokubanzi, idosi yemveliso enomxholo we-60% yi-100 - 120 ml/L. Idosi ye-copper sulfate yi-15 - 20 g/L. Ukongeza, ngaphambi kokufaka i-electroplating, faka iindawo zokugquma kwisisombululo se-1% - 2% sale mveliso ukuze iindawo zokugquma zibe kwimeko esebenzayo. Ukufaka i-electroplating emva kweli nyathelo kunokuphucula ngakumbi isiphumo. I-Hydroxyethylidene diphosphonic acid (HEDP) luhlobo olutsha lwe-electroplating complexing agent engena-chlorine. Isetyenziswa njenge-arhente ephambili yokuzinzisa umgangatho wamanzi kwinkqubo yamanzi okupholisa ajikelezayo, idlala indima yokuthintela ukugqwala kunye nokuthintela isikali. Le mveliso yenye yee-arhente zonyango lwamanzi ze-polyphosphonic acid eziphilayo. Kukwakho nezinye iintlobo zolu hlobo lweemveliso eziveliswa eTshayina, ezifana ne-amino trimethylene phosphonic acid (ATMP): [CH2PO(OH)2]3N, kunye ne-ethylenediamine tetra(methylene phosphonic acid) (EDTMP), njl. Ii-organic polyphosphonic acids zaphuhliswa ngasekupheleni kweminyaka yoo-1960 kwaye zaqatshelwa malunga neminyaka yoo-1970. Ukuvela kolu hlobo lwee-arhente zonyango lwamanzi kuye kwaphucula iteknoloji yonyango lwamanzi ngenyathelo elikhulu. Xa kuthelekiswa nee-inorganic polyphosphates, ii-organic polyphosphonic acids zinozinzo oluhle lweekhemikhali, azilula ukuzisebenzisa nge-hydrolyze, zinokumelana namaqondo obushushu aphezulu, zifuna idosi encinci ye-arhente, kwaye zineempawu zokubola kunye nokuthintelwa kwesikali. Ziluhlobo lwee-cathodic corrosion inhibitors kwaye zikwaluhlobo lwee-non-stoichiometric scale inhibitors. Xa zisetyenziswa kunye nezinye ii-arhente zonyango lwamanzi, zibonisa isiphumo esifanelekileyo sokusebenzisana. Zinamandla amahle kakhulu okuchela kwii-ion ezininzi zesinyithi ezifana ne-calcium, i-magnesium, i-copper, kunye ne-zinc. Zinefuthe elihle lokuyekisa ukusebenza kwiityuwa ezingaphiliyo zezi metali, ezifana neCaSO4, CaCO3, MgSiO3, njl. Ngenxa yoko, zisetyenziswa kakhulu kubuchwepheshe bokucoca amanzi. Ii-reagents ze-phosphorylating zisetyenziselwa i-serine kunye ne-pyranose ekhuselweyo.
Ukupakishwa kunye nokuthunyelwa
Ukupakisha: 25kg njengeemfuno zabathengi.
Ukuthunyelwa: kungokweekhemikhali eziqhelekileyo kwaye kungathunyelwa ngololiwe, ulwandle nomoya.
Gcina kwaye ugcine
Ixesha lokuphelelwa: Iinyanga ezingama-24 ukususela kumhla wokwenziwa kwayo kwiphakheji yokuqala engavulwanga igcinwe kwindawo epholileyo neyomileyo kude nelanga elithe ngqo, amanzi.
Indawo yokugcina umoya, Ukomisa kubushushu obuphantsi, Yahlulwe kwii-oxidants, ii-asidi.
