ʻAkika Etidronic/ HEDP/CAS:2809-21-4
kikoʻī
| Mea | Nā kikoʻī |
| helehelena | Ke aniani keʻokeʻo |
| ʻIke hana (e like me ka waikawa)% | ≥98.0% |
| ʻIke hana (e like me HEDP.H20)% | ≥90.0% |
| PH (1%) | ≤2 |
| ʻAkika phosphoric (e like me PO43-)% | ≤0.5 |
| Chloride (e like me CI-)ppm | ≤100 |
| ʻIona Fe ppm | ≤5 |
| ʻAkika phosphorous (e like me PO33-)% | ≤0.8 |
Hoʻohana
ʻO kēia huahana ka mea maka nui no ka electroplating cyanide-free. Ke hoʻohui ʻia i loko o kahi hopena electroplating keleawe cyanide-free, loaʻa iā ia ka ikaika hoʻopili maikaʻi i ka wā e electroplating pololei ai i kahi papa keleawe ma luna o ka hao sodium. He laumania ka uhi a he ʻōlinolino maikaʻi. Ma keʻano laulā, ʻo ka nui o ka huahana me ka ʻike o 60% he 100 - 120 ml/L. ʻO ka nui o ke keleawe sulfate he 15 - 20 g/L. Eia kekahi, ma mua o ka electroplating, e hoʻokomo i nā ʻāpana plating i loko o kahi hopena 1% - 2% o kēia huahana e hoʻolilo i nā ʻāpana plating i mokuʻāina i hoʻāla ʻia. Hiki i ka electroplating ma hope o kēia hana ke hoʻomaikaʻi hou aku i ka hopena. ʻO ka Hydroxyethylidene diphosphonic acid (HEDP) kahi ʻano hou o ka chlorine-free electroplating complexing agent. Hoʻohana ʻia ia ma ke ʻano he mea nui no ka hoʻopaʻa ʻana i ka maikaʻi o ka wai i loko o ka ʻōnaehana wai hoʻoluʻu e kaʻapuni ana, e pāʻani ana i ke kuleana o ka pale ʻana i ka palaho a me ka pale ʻana i ka unahi. ʻO kēia huahana kekahi o nā mea mālama wai polyphosphonic acid organik. Aia kekahi mau ʻano ʻē aʻe o kēia ʻano huahana i hana ʻia ma Kina, e like me ka amino trimethylene phosphonic acid (ATMP): [CH2PO(OH)2]3N, a me ka ethylenediamine tetra(methylene phosphonic acid) (EDTMP), a pēlā aku. Ua hoʻomohala ʻia nā waikawa polyphosphonic organik i ka hopena o nā makahiki 1960 a ua ʻike ʻia ma kahi o nā makahiki 1970. ʻO ka puka ʻana mai o kēia ʻano mea hana wai ua hoʻonui i ka ʻenehana hana wai ma kahi ʻanuʻu nui. Ke hoʻohālikelike ʻia me nā polyphosphates inorganic, loaʻa i nā waikawa polyphosphonic organik ke kūpaʻa kemika maikaʻi, ʻaʻole maʻalahi ke hydrolyze, hiki ke kū i nā mahana kiʻekiʻe, koi i kahi liʻiliʻi o ka mea hana, a loaʻa pū kekahi mau waiwai o ka corrosion a me ka scale inhibition. He ʻano lākou o nā cathodic corrosion inhibitors a he ʻano hoʻi o nā non-stoichiometric scale inhibitors. Ke hoʻohana ʻia me nā mea hana wai ʻē aʻe, hōʻike lākou i kahi hopena synergistic kūpono. Loaʻa iā lākou ka hiki ke chelating maikaʻi loa no nā ion metala he nui e like me ka calcium, magnesium, keleawe, a me ka zinc. Loaʻa iā lākou kahi hopena deactivation maikaʻi ma nā paʻakai inorganic o kēia mau metala, e like me CaSO4, CaCO3, MgSiO3, a pēlā aku. No laila, hoʻohana nui ʻia lākou i ka ʻenehana mālama wai. Hoʻohana ʻia nā reagents phosphorylating no ka serine a me ka pyranose i pale ʻia.
ʻŌpala a me ka Hoʻouna ʻana
Hoʻopili ʻia: 25kg e like me nā koi a ka mea kūʻai aku.
Hoʻouna: no nā kemika maʻamau a hiki ke hāʻawi ma ke kaʻaahi, ke kai a me ka lewa.
Mālama a me ka mālama ʻana
Ola papa: 24 mahina mai ka lā i hana ʻia ai i loko o ka pahu i wehe ʻole ʻia mua i mālama ʻia i kahi maloʻo a me kahi anuanu, mai ka lā pololei, ka wai.
Hale kūʻai ea, hoʻomaloʻo wela haʻahaʻa, hoʻokaʻawale ʻia mai nā mea hoʻomake a me nā waikawa.










